8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module

Customization: Available
Structure: Multilayer Rigid PCB
Dielectric: Fr4 Em825 0.8/1.0mm

Products Details

Basic Info.

Model NO.
GW-1920422115
Material
Epoxy Paper Laminate
Application
Telecom
Flame Retardant Properties
V0
Processing Technology
Immersion Gold+OSP
Production Process
Blind&Buried Vias
Base Material
Copper
Insulation Materials
Epoxy Resin
Layer Count
8layer HDI PCB 2+N+2
HDI Structure
1+N+1 to Any Layer
Min. Trace/Space
2/2mil
Blind/Buried Vias
0.1mm Laser Drilling
Transport Package
Vacuum + Carton Packing
Origin
Made in China
HS Code
8534001000
Production Capacity
500000PCS/Month

Packaging & Delivery

Package Size
10.00cm * 20.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

HDI Layer Count  4L-32L mass production, 34L-64L quick-turn
Material High Tg material (Recommend Shengyi Material)
Finished Board Thickness 0.8-4.8mm
Finished Copper Thickness Hoz-8oz
Max. Board Size 600X800mm
Min. Drilling Size 0.15mm, 0.1mm(laser drilling)
Blind/Buried vias depth ratio 1:1
Min. Line Width/Space inner 2/2mil, outer 3/3mil
Surface Finish ENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect.
Standard IPC Class 2, IPC Class 3, Millitary
Application Industrial, Automotive, Consumer,Telecom, Medical, Military, Security ect.
Other 3+N+3 to any layer

HDI circuit board advantages:
1. Reduce PCB cost: when the density of PCB increases more than eight layers, it will be manufactured with HDI, and the cost will be lower than that of the traditional pressing process;
2. Increase circuit density: interconnection between traditional circuit board and parts;
3. Conducive to the use of advanced construction technology;
4. Better electrical performance and signal correctness;
5. Better reliability;
6. Improve the thermal properties;
7. Improve RF interference, electromagnetic interference and electrostatic discharge (RFI/EMI/ESD);
8. Increase design efficiency.

Maybe we don't have the lowest price, but can guarantee you the best quality.
If you are interested, welcome to contact us. Here is the contact information as follows:
Shanghai Gawin Electronic Technology Co., Ltd.
Web: gawinpcba.en.made-in-china.com


Main Inspection Equipement
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module



 

Contact us

Please feel free to give your inquiry in the form below We will reply you in 24 hours