Basic Info.
Model NO.
FL0298
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V1
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Brand
Fastline
Board Thickness
1.6mm
Copper Thickness
1oz
Material Type
Rogers 4350b
Surface Treatment
Enig
Solder Mask
Green
Silk Screen Color
White
Board Layer
1-50
Shipping Type
DHL, UPS, TNT, EMS, FedEx etc
Packing Type
Carton + Vacuum
Lead Time
5-7 Days
Transport Package
Vacuum+Carton Packing
Specification
RoHS, ISO9001, UL, SGS
Trademark
Fastline
Origin
Shenzhen, China
HS Code
8534009000
Production Capacity
20000 Square Meter/Mon
Product Description
Product Description
4 Layer Impedance Contro PCB Prototype RO4003C Mixed With FR-4 Microwave PCB Board Applied In Balanced Amplifier
Commodity Introduction
This is a type of RO4350B PCB for the application of Balanced Amplifier. It's a
4 layer board at 1.6mm thick. The base laminate is from Rogers Corp. and ITEQ. Solder mask
and silkscreen from Nanya and Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerb
-er data. Each 10 boards or panels are packed separately.
Parameters & Data Sheet
| PCB SIZE | 52 x 39mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| RO4003C 12mil Er 3.38 | |
| copper ------- 18um(0.5oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 18um(0.5oz) MidLayer 2 | |
| RO4003C 12mil Er 3.38 | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3/0.5mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 1521 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | Differential pairs impedance control, Layer 3 , 4mil / 4mil , 91 ohm+/-10%, Single trace impedance control, Layer 4, 6mil, 49ohm+/-10% |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4. RO4003C 12mil |
| Final foil external: | 1.5oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (21.5%) 2 micoinch over 100 microinch nickel |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Balanced amplifier, Dsl Modems ADSL Router 3G Modem Gsm Alarm AC To DC Converter |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Microsection Hole Wall (um)
| Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um | ||||
| NO. | A | B | C | D | E | F | AVE |
| 1 | 22.800 | 22.300 | 23.700 | 23.700 | 22.300 | 24.500 | 23.000 |
| 2 | 27.000 | 22.300 | 22.500 | 22.500 | 22.500 | 22.600 | 23.600 |
| 3 | 23.000 | 22.300 | 27.000 | 27.000 | 22.300 | 22.800 | 23.400 |
Outline dimension Unit: mm
| NO. | Required Dimension (toerance) | Actual dimension | ||||
| 1 | 97.00 | ±0.15 | 97.02 | 97.01 | 97.01 | 97.02 |
| 2 | 100.00 | ±0.15 | 100.02 | 100.01 | 99.99 | 100.01 |
Hole Size and Slot Dimension (mm)
| NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension | ||||
| 1 | 0.250 | ±0.076 | Y | via | via | via | via |
| 2 | 0.406 | ±0.076 | Y | via | via | via | via |
| 3 | 3.174 | ±0.076 | Y | 3.200 | 3.175 | 3.175 | 3.200 |
Workshop:
Our service:
| PCB capability and services: |
| 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
| 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
| 3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
| 4. Quantities range from sample to mass order |
| 5. 100% E-Test |
| SMT(Surface Mounting technology),DIP. |
| 1. Material Sourcing Service |
| 2. SMT assembly and Through hole components insertion |
| 3.100% AOI testing |
| 4. IC pre-programming / Burning on-line |
| 5.ICT testing |
| 6.Function testing as requested |
| 7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
| 8.Conformal coating |
| 9.OEM/ODM also welcomed |
Contact us: