Basic Info.
Model NO.
PCBA-024
Material
Epoxide Woven Glass Fabric Laminate
Application
Consumer Electronics
Flame Retardant Properties
HB
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Base Material
Aluminum
Insulation Materials
Epoxy Resin
Brand
Jxpcba
Layer
1-32 Layers
Board Thickness
0.2-8.0mm
PCB Testing
PCB: Ict Testing and Flying Probe Testing
PCBA Packaging
Static Packaging, Shockproof Packaging, Anti-Drop
Qualified
Ipc-a-610cclass 2 Standard
Thick Copper
18um-140um(4oz)
Service
OEM/ODM, EMS
PCB Materials
Fr4
PCB Soldermask
Green
PCB Silkscreen
White
PCB Tg
Tg170
IC
Qfn
IC Type
BGA
SMT
01005
PCBA Testing
Function Testing 100%
Transport Package
ESD Bag+Bubble Wrapped +Carton
Specification
customized PCBA
Trademark
jxpcba
Origin
China
HS Code
8542310000
Production Capacity
1000000/Month
Product Description
Product Description
| Specification: | ||||
| PCB layers: | 1-24layers | |||
| PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | |||
| PCB max. board size: | 620*1100mm | |||
| PCB certificate: | RoHS Directive-Compliant | |||
| PCB Thickness: | 1.6 ±0.1mm | |||
| Out Layer Copper Thickness: | 0.5-5oz | |||
| Inner Layer Copper Thickness: | 0.5-4oz | |||
| PCB max. board thickness: | 6.0mm | |||
| Minimum Hole Size: | 0.20mm | |||
| Minimum Line Width/Space: | 3/3mil | |||
| Min. S/M Pitch: | 0.1mm(4mil) | |||
| Plate Thickness and Aperture Ratio : | 30:1 | |||
| Minimum Hole Copper: | 20µm | |||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | |||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | |||
| Hole Position Deviation: | ±0.05mm (2mil) | |||
| Outline Tolerance: | ±0.05mm (2mil) | |||
| PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | |||
| PCB solder mask: | Black, white, yellow | |||
| Legend: | White | |||
| E-test: | 100% AOI, X-ray, Flying probe test. | |||
| Outline: | Rout and Score/V-cut | |||
| Inspection Standard: | IPC-A-610CCLASSII | |||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | |||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | |||
| PCB Assembly OEM Service | ||||
| Electronic Components Material Purchasing | ||||
| Bare PCB Fabrication | ||||
| Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service | ||||
| PCB Assembly Service: SMT, BGA, DIP | ||||
| PCBA test:AOI, In-Circuit Test (ICT), Functioal Test (FCT) | ||||
| Conformal Coating Service | ||||
| Prototyping and Mass Production |
| PCBA ODM service | ||||
| PCB Layout, PCBA Design According To Your Idea | ||||
| PCBA Copy/Clone | ||||
| Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design | ||||
| Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming | ||||
| Embedded User Interface Design / lSystem Hardware Design |
