- Overview
- Product Parameters
- Product Description
- Our Advantages
- Company Profile
- Certifications
- FAQ
- After Sales Service
Basic Info.
Product Description
LuckFox Pico Plus RV1103 Linux Micro Development Board Integrates ARM Cortex-A7/RISC-V MCU/NPU/ISP Processors With Ethernet Port
Processor: Cortex [email protected] + RISC-V
Neural network processor (NPU): O.5TOPS, support int4 int8, int16
National Image Processor (ISP): Input 4M @30fps (Max)
Memory: 64MB DDR2
USB: USB 2.0 Host/Device
Camera Interface: MIPI CSI 2-lane
GPIO: 24 GPIO pins
Network port: 10/100M Ethernet controller and embedded PHY
Default storage media: Micro SD card holder
Single-core ARM Cortex-A7 32-bit core with integrated NEON and FPU.
Built-in Rayson Microelectronics self-developed 4th generation NPU, with high computing precision, supporting int4, in8, int16 mixed quantisation.
Built-in self-developed 3rd generation ISP3.2, supports 4 megapixels, HDR, WDR, multi-level noise reduction and other image enhancement and correction.support HDR, WDR, multi-level noise reduction and other image enhancement and correction algorithms.
Powerful encoding performance, support intelligent encoding, adaptive code stream saving according to the scene, 50% code rate saving compared to conventional.
CBR mode bit rate savings of more than 50%, so that the shooting screen is both high-definition, smaller size, storage space.
Built-in RISC-V MCU design, support low power consumption and fast startup, support 250ms fast capture.
The built-in RISC-V MCU is designed to support low-power fast startup, support 250ms fast capturing, and load Al model library at the same time, so that face recognition can be completed in "1 second".
Built-in 16-bit DRAM DDR2 to maintain demanding memory bandwidth.
Integrated built-in POR, audio codec and MAC PHY.
PCB Techinecal Capacity | ||||
Layers | Mass production: 2~58 layers / Pilot run: 64 layers | |||
Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm | |||
Materials | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , TF, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc | |||
Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) | |||
Max. Copper Thickness | 6.0 OZ / Pilot run: 12OZ | |||
Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) | |||
Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | |||
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA technical Capacity | ||||
Advantages | ----Professional Surface-mounting and Through-hole soldering technology | |||
----Various sizes like 1206,0805,0603 components SMT technology | ||||
----ICT(In Circuit Test),FCT(Functional Circuit Test) | ||||
----PCB Assembly With UL,CE,FCC,Rohs Approval | ||||
----Nitrogen gas reflow soldering technology for SMT. | ||||
----High Standard SMT&Solder Assembly Line | ||||
----High density interconnected board placement technology capacity. | ||||
Components | Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP | |||
Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball | ||||
Testing | Flying Probe Test,X-ray Inspection AOI Test | |||
SMT | Position accuracy: 20 um | |||
Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP | ||||
Max. component height: 25mm | ||||
Max. PCB size: 680×500mm | ||||
Min. PCB size: no limited | ||||
PCB thickness: 0.3 to 6mm | ||||
Wave-Solder | Max. PCB width: 450mm | |||
Min. PCB width: no limited | ||||
Component height: Top 120mm/Bot 15mm | ||||
Sweat-Solder | Metal type: part, whole, inlay, sidestep | |||
Metal material: Copper, Aluminum | ||||
Surface Finish: plating Au, plating sliver, plating Sn | ||||
Air bladder rate: less than 20% | ||||
Press-fit | Press range: 0-50KN | |||
Max. PCB size: 800X600mm |
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Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
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Shenzhen Yongchangtai Co., Ltd. Was established in Shenzhen city in 2009.
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1. who are we?
We are based in Guangdong, China, start from 2009,sell to Northern Europe(15.00%),Eastern Europe(15.00%),Africa(15.00%),North America(15.00%),Western Europe(10.00%),South America(10.00%),South Asia(5.00%),Southeast Asia(5.00%),Domestic Market(2.00%),Eastern Asia(2.00%),Mid East(2.00%),Central America(2.00%),Oceania(2.00%). There are total about 301-500 people in our office.
2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;
3.what can you buy from us?
PCBA,PCB Assembly,printed circuit board assembly,electronic circuit board,electronic boards
4. why should you buy from us not from other suppliers?
Advanced equipments, high skilled sales and manufacturing teams, excellent quality,over 10 years' focus on electronic components,manufacturing and full assembly, our customers such as Faurecia,Midea, etc.
5. what services can we provide?
Accepted Delivery Terms: FOB,CFR,CIF,EXW,CPT,DDU,Express Delivery;
Accepted Payment Currency:USD,HKD,CNY;
Accepted Payment Type: T/T,Credit Card,PayPal,Western Union;
Language Spoken:English,Chinese
Pre-Sale and After-Sale Service
1 Hour quotation
2 hours complaint feedback
7*24 hour technical support
7*24 order service
7*24 hour delivery
7*24 production run