Basic Info.
Model NO.
PCBA-D-007
Material
Aluminum Covered Copper Foil Layer
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Epoxy Resin
Brand
OEM
Copper Thickness
1/2oz 1oz 2oz 3oz
Board Thickness
1.6mm
Min. Hole Size
0.25mm
Min. Line Width
0.075mm
Surface Finishing
HASL/OSP/Enig
Transport Package
Carton
Specification
10 X 10 CM
Trademark
OEM
Origin
China
Production Capacity
5000 PCS Per Week
Product Description
Professional Printed Circuit Board For electric product PCBA Customized, PCBA SMT Manufacturer
As below specification for reference:
| Item | Process Capability |
| Layer Counts | 1-24L |
| Material | FR-4, Ceramic, Alu Base ,Cu base. Rogers etc |
| Maximum Size | 600mm X 1500mm |
| Board Outline Tolerance | ±0.10mm |
| Board Thickness | 0.20mm--8.00mm |
| Thickness Tolerance( t≥0.8mm) | ±8% |
| Thickness Tolerance( t<0.8mm) | ±10% |
| Insulation Layer Thickness | 0.075mm--5.00mm |
| Minimum Line | 0.075mm |
| Minimum Space | 0.075mm |
| Out Layer Copper Thickness | 18um--350um |
| Inner Layer Copper Thickness | 17um--210um |
| Drilling Hole (Mechanical) | 0.15mm--6.35mm |
| Finish Hole (Mechanical) | 0.10mm--6.30mm |
| Diameter Tolerance (Mechanical) | 0.05mm |
| Registration (Mechanical) | 0.075mm |
| Aspect Ratio | 16:1 |
| Solder Mask Type | LPI |
| SMT Mini. Solder Mask Width | 0.075mm |
| Mini. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.25mm--0.60mm |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,ENIG,Chem. Tin,Chem Silver. Flash Gold,OSP,Gold finger |
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