Basic Info.
Model NO.
PCBA-0026
Material
Polyester Glass Fiber Mat Laminate
Application
Consumer Electronics
Flame Retardant Properties
HB
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Jxpcba
Layer
1-32 Layers
Board Thickness
0.2-8.0mm
PCBA Testing
PCB: Ict Testing and Flying Probe Testing, PCBA: a
PCBA Packaging
Static Packaging, Shockproof Packaging, Anti-Drop
Qualified
Ipc-a-610cclass 2 Standard
Thick Copper
18um-210um(6oz)
Service
OEM/ODM, EMS
Materials
Fr-4/Fr-4tg170//Aluminum-Based Materials
Surface Treatment
HASL, Enig, Gold Fingers, etc.
Offer Service
PCBA Prototype, PCBA Debugging, PCBA ODM (Project
Transport Package
ESD Bag+Bubble Wrapped +Carton
Specification
customized PCBA
Trademark
jxpcba
Origin
China
HS Code
8542310000
Production Capacity
1000000/Month
Product Description
PCB assembly OEM service
- Electronic components material purchasing
- Bare PCB fabrication
- PCB Assembly Service. (SMT, BGA, DIP)
- FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT)
- Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service
- Conformal coating service
- Prototyping and mass production...
PCBA ODM service
- PCB layout, PCBA design according to your idea
- PCBA copy/clone
- Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
- Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
- Embedded User Interface Design / lSystem Hardware Design...
| One-stop PCBA | PCB+components sourcing+assembly+test+package |
| Assembly details | SMT and Thru-hole |
| Lead Time | Prototype: 7-15 work days. Batch order 20~25 work days usually |
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, Functional test |
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
| Components details | Passive Down to 0201 size |
| BGA and VFBGA | |
| Leadless Chip Carriers/CSP | |
| Double-sided SMT Assembly | |
| Fine Pitch to 0.8mils | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
| PCB assembly process | Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing--Temperature & Humidity&Aging ect. Testing |
Company Information
Shenzhen Jingxin Electronic Technology Electronics Co., Ltd was founded in 2002,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers.
We have more than 20 years of SMT manufacturing experience, well appointed SMT ,DIP and assembly lines, offering one stop service from SMT,FPC,DIP,EMS, conformal coating, testing, final assembly, component procurement ,design, peripheral products support and so on. we are equipped with High-speed and accurately SMT Equipment ,and we provide a whole range of SPI,AOI,ICT,FCT,X-RAY,ROHS and aging testing for products. All ourshop floors are dust free, all lines are lead free, we are ISO9001 certified company.
We open bom cost quotation,with high quality control strategy and 8D analysis method,we focus on top market customers, such as PCBAs on medical , industrial , financial,robotic,automobile , New Energy.
We service for many global customers,such as the globe leader in grain processing and a leading solution provider;the top 3 in medical industry customer in China; the global leader in Telehealth Sensors industry and so on.
Our Service
| PCB capability and services: |
| 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
| 2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
| 3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
| 4. Quantities range from sample to mass order |
| 5. 100% E-Test |
| SMT(Surface Mounting technology),DIP. | ||
| 1. Material Sourcing Service | ||
| 2. SMT assembly and Through hole components insertion | ||
| 3.100% AOI testing | ||
| 4. IC pre-programming / Burning on-line | ||
| 5.ICT testing | ||
| 6.Function testing as requested | ||
| 7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) | ||
| 8.Conformal coating | ||
| 9.OEM/ODM also welcomed | ||
| EMS Capacity | ||
| electronic product final assembly | 100k/month | |
Specifications
1.UL,RoHS,ISO,SGS, IPC Approved; 
2.Commitment of Quality Assurance;
3.Fast accurate Delivery.
Welcome to Jingxin PCB&PCBA Manufacturer
- PCB And PCB Assembly For One-stop Service with Original Components According the BOM.
-IC Imported from Digikey / Farnell etc.
- Low Cost with High Quality, Commitment of Quality Assurance.
- For 15 years Experience in PCB & PCBA Field. ( Our Factory owns advanced production equipment and experienced technical personnel. )
Requested information for PCB assembly:
1. Gerber file of the bare PCB board
2. BOM (Bill of material) for assembly
To short the lead time, please kindly advise us if there is any acceptable components substitution
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Schematic if necessary
JX PCBA Package
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer with a separated factory.
Q:What do I need to offer for production?
A: Basiclly PCB Gerber file and BOM list, if you have other requirement,just let us know?
Q: Are my PCB files and BOM safe when I submit them to you for manufacturing?
A: We respect customer's copyright and will never manufacture PCB/PCBA for someone else with your files unless we receive written's permission from you, nor we'll share these files with any other 3rd parties.
Q:What is your minimum order quantity?
A: Our MOQ is 1 PCS.
Shenzhen Pcb Assembly Prototype Manufacturer/Pcb Assembly Suppliers
Q:What is your turnkey service of PCBA?
A: PCB production, material procurement, SMT processing, PCBA prototype, PCBA debugging, PCBA ODM (project development), software supporting (chip decryption, SCM development, disassembly modification, chips programming)