Basic Info.
Model NO.
FONIETO-1
Layers
1-22 Layers
Base Material
FR-4
Certification
RoHS, CCC, ISO
Customized
Customized
Condition
New
Solder Resist Color
Green;Red;Yellow;Black;White
Order Qty
No Limited
Shape
Retangular, Round, Slots, Cutouts, Complex, Irreg
Surface Finished
HASL, Gold Finger, OSP, Enig, Peelable Mask
Transport Package
Inner Vacuum Packing Outer Carton Box
Specification
FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
Trademark
OEM, ODM
Origin
China
HS Code
8534009000
Production Capacity
100000pieces/Year
Product Description
PCBA Production Capacity: Embark on a journey where technological excellence seamlessly blends with exceptional craftsmanship at Hangzhou Fonieto Technology Co., Ltd. Our magnificent Printed Circuit Board Assembly (PCBA) production prowess is a shining testament to the forefront of modern innovation, meticulously engineered to satisfy the stringent demands of a myriad of industries. Within our cutting-edge, state-of-the-art facilities, we forge tailored solutions that exemplify both precision and unwavering reliability. Discover the zenith of efficiency with each uniquely designed circuit board solution we provide, meticulously crafted to not just meet, but dramatically exceed your expectations, guaranteeing unmatched quality and outstanding performance at every stage. At Hangzhou Fonieto, we don't just create PCBs; we design the future of electronic solutions. Our commitment to excellence ensures that each product is a masterpiece of engineering, backed by advanced technology and unparalleled expertise. With a focus on sustainability and innovation, our PCBA production process is designed to deliver not only superior products but also exceptional value and long-term reliability. Trust in our legacy of precision and let us elevate your projects with our superior craftsmanship and innovation-driven approach. Your vision is our blueprint for brilliance.
| Delivery time | Samples | 5pcs ~ 100pcs | 1 Day | All the above time starts after all components and PCB materials are ready |
| Small batch | 101pcs ~ 5000 pcs | 3 Days | ||
| Medium batch | 5001pcs ~ 10000 pcs | 5 Days | ||
| Large batch | >10001pcs | 15 Days | ||
| Production capacity | SMT 2 million points/day; DIP 250,000 points/day; 5-10 models/day | |||
| Component Range | Min. 01005(0.4mm*0.2mm) Max. 55mm(H25mm) | |||
| PCB Size | Min. 50mm*50mm (Suggest >100mm*100mm) Max. 460mm*1200mm | |||
| Max. Thickness | The batch size is not more than 3 mm, and the model is unlimited | |||
| Placement Accuracy | +/- 40 micrometer (Chip) +/- 30 micrometer (IC) | |||
| PCB Types | PCB rigid board (FR-4, metal substrate), PCB flexible board (FPC), soft and hard PCB | |||
| File Format | Bill of Materials (BOM), PCB files (Gerber files and PCB design format files), coordinate files | |||
| Solder paste tin wire tin bar | Lead-free solder paste, customed solder paste, Brand solder paste | |||
| Steel Mesh | Laser stencil IC and BGA components can reach PC-2 Class | |||
| Component Packaging | We accept SMT components in reel, cutting tape, tube, tray, etc. which can be packed on the machine. DIP components can be packed in bulk. | |||
| Component Purchase Service | 1 Foundry only (Customers provide PCB components) 2 Part of the substitute materials (customers provide core components and special components, we can purchase other components on behalf of us) 3 A full set of substitute materials (reduce purchase cost and communication cost) | |||
| Test | 1IQC: ncoming inspection. 2 IPQC: In-production inspection. 3 Visual QC: regular quality inspection. 4 On-line AOI: Check the soldering effect of solder paste, SMD components, few parts or component polarity. 5 X-Ray: Check BGA, QFN and other high-precision hidden PAD components. 6 Test function and performance according to customer's test procedures and steps. 7 Aging test: According to the customer's test time for aging. | |||
