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Basic Info.
Packaging & Delivery
Product Description
| Name | Tin Lead solder paste |
| Alloy | Sn62.8Ag0.4Pb |
| Package | 500g/bottle |
| Melting point | 179~190ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
Low Melting Point The solder paste Sn62.8Ag0.4Pb boasts a low melting point due to its specific alloy composition, facilitating easy reflow soldering processes.
This characteristic makes it particularly suitable for delicate electronic components that might be sensitive to high temperatures.Superior Wetting Ability This solder paste exhibits excellent wetting ability, allowing for quick and reliable solder joint formation.
The presence of silver (Ag) enhances the alloy's ability to spread over surfaces, ensuring strong, conductive connections with minimal voids.Enhanced Mechanical Strength The addition of a small amount of silver (Ag) to the traditional tin-lead (SnPb) solder improves the mechanical strength of the solder joints.
This enhancement is crucial for applications requiring robust physical connections, such as in mechanical assemblies or high-vibration environments.Eutectic Composition With a composition close to eutectic, Sn62.8Ag0.4Pb solder paste has a sharply defined melting point, which simplifies thermal profiling during soldering.
This property minimizes the risk of defects associated with the solidification process, such as cold joints or incomplete wetting.
Broad Application Range This solder paste is designed for a wide array of soldering applications, including surface-mount technology (SMT), through-hole, and mixed-technology PCB assemblies. Its formulation is optimized for both manual and automated soldering processes, making it a versatile choice for the electronics manufacturing industry.
Our product is packaged in eco-friendly green cans, each with a standard weight of 500 grams, though customization is available to accommodate unique customer requirements. Every can bears a label detailing the product model, alloy composition, batch number, and weight. The solder paste also comes with a label that offers clear instructions for use, as well as safety and health information. "ZS.HX Zhongshi" is our company's esteemed registered trademark.
To ensure enhanced storage stability, the solder paste should be stored in a cool environment at 5 ºC. When stored at room temperature of 25 ºC or in a controlled environment of 35 ºC, it's important to periodically monitor the viscosity over 180 days at 25 ºC and over 90 days at 35 ºC, making sure the viscosity increase does not exceed 10%.
For continuous printing stability, use the same solder paste for 8 hours of printing and evaluate the viscosity with a steel net. This procedure should be continued after storage and repeated for three consecutive days. A consistent viscosity is verified after three days of continuous printing.
Lead-free solder wire
Tin-lead solder wire
Solder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
