Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50

Customization: Available
state: Liquid
pH: Neutral

Products Details

Basic Info.

Model NO.
Paste Soldering
Type
Solder Paste
Melting Point
<200℃
Chemical Composition
Sn-Pb
Function
Make the Liquid Solder Flow
Application
Electroslag Welding
Manufacturing Method
Smelting
Alloy
Tin Lead
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application 2
SMD
Form
Paste Soldering
Transport Package
Foam Box
Specification
100g to 1000g
Trademark
XF Solder
Origin
China
HS Code
3810100000
Production Capacity
30tons/Month

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

SMT SMD BGA PCB Paste Soldering
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50
Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50Tin Lead SMT SMD BGA PCB Paste Soldering 50 50 Sn50pb50
Tin Lead Solder Paste Sn63Pb37, composed of 63% tin (Sn) and 37% lead (Pb), represents a conventional soldering material that has been widely used in electronics assembly for decades. It's also known as Solder Paste 63 37. This paste simplifies the soldering process and creates reliable connections in various applications for it's accurate printing and soldering effect.

Sn63Pb37 solder paste is a carefully formulated mixture of solder alloy particles, flux, and binder. It plays a crucial role in surface mount technology (SMT) and electronics assembly, ensuring strong and dependable soldering connections.

Applications of Tin Lead Solder Paste Sn63Pb37 63 37:

Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.

Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.

It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.

General soldering and repairing works for small projects or for hobbyist.

 

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